Wer wir sind

als führender Hersteller von Verbindungshalbleitermaterial in China. pam-xiamen entwickelt fortschrittliche Kristallwachstums- und Epitaxietechnologien, die von Germaniumwafern der ersten Generation, Galliumarsenid der zweiten Generation mit Substratwachstum und Epitaxie auf iii-v-Silizium-dotierten4
Weiterlesen
Nach mehr als 20 Jahren der Akkumulation und Entwicklung, hat unser Unternehmen einen offensichtlichen Vorteil in der Technologie Innovation und Talent-Pool. In Zukunft müssen wir das Tempo der tatsächlichen Maßnahmen beschleunigen, um unseren Kunden bessere Produkte und Dienstleistungen zu bieten
Doktor Chan -CEO von Xiamen Powerway Advanced Material Co., Ltd.

unsere Produkte

blauer Laser

Gan-Vorlagen

pam-xiamen's Template-Produkte bestehen aus kristallinen Schichten aus Galliumnitrid (gan), Aluminiumnitrid (aln), Aluminiumgalliumnitrid (algan) und Indiumgalliumnitrid (ingan), die auf Saphirsubstraten abgeschieden sind, Die Templatprodukte von Siliciumcarbid oder Siliciumpam-Xiamen ermöglichen 20-50% kürzere Epitaxiezykluszeiten und höherwertige4

Gan auf Silizium

freistehendes gan-Substrat

pam-xiamen hat die Herstellungstechnologie für freistehende (Galliumnitrid) gan Substratwafer, die für uhb-led und ld ist, etabliert. gewachsen durch Hydriddampfphasenepitaxie (Hvpe) -Technologie, hat unser Gansubstrat eine geringe Defektdichte.

Gaas Kristall

GaAs (Galliumarsenid) -Wafer

pwam entwickelt und fertigt Verbundhalbleitersubstrate - Galliumarsenidkristall und -wafer. Wir haben fortschrittliche Kristallzüchtungstechnologie, vertikales Gradientenfrosten (vgf) und Gaas-Wafer-Bearbeitungstechnologie verwendet, eine Produktionslinie vom Kristallwachstum, Schneiden, Schleifen bis zur Polierbearbeitung etabliert und gebaut ein 4

sic Kristall

sic Epitaxie

Für die Entwicklung von Siliziumkarbid-Bauelementen bieten wir kundenspezifische Dünnfilm-Silizium-Epitaxie auf 6h- oder 4h-Substraten an. sic epi wafer wird hauptsächlich für Schottky-Dioden, Metall-Oxid-Halbleiter-Feldeffekttransistoren, Sperrschicht-Feldeffekttransistoren, bipolare Sperrschichttransistoren, Thyristoren, GTO und Bipolar mit isoli4

sic Kristall

sic Substrat

pam-xiamen bietet Halbleiter Siliziumkarbid Wafer, 6h sic und 4h sic in verschiedenen Qualitäten für den Forscher und Industriehersteller. wir haben sic Kristallwachstumstechnologie und sic Kristallwafer-Verarbeitungstechnologie entwickelt, etablierte eine produktionslinie zu hersteller sic substrat, die in gan epitaxie gerät, power geräte, Hochtem4

gan expitaxy

Gan-basierter LED-Epitaxialwafer

pam-xiamens Gan (Galliumnitrid) -basierter LED-Epitaxialwafer ist für Anwendungen mit ultrahoher Helligkeit für blaue und grüne Leuchtdioden (LED) und Laserdioden (LD) geeignet.

Gan-Haemt-Epitaxie

Gan-HaMt-Epitaxialwafer

Galliumnitrid (Gan) Hemts (Transistoren mit hoher Elektronenbeweglichkeit) sind die nächste Generation von HF-Leistungstransistor-Technologie. Dank der Gan-Technologie bieten Pam-Xiamen nun Algan / Gan-Hemt-Epi-Wafer auf Saphir oder Silizium und Algan / Gan auf Saphir-Template .

sic Kristall

sic Wafer zurückgewinnen

pam-xiamen ist in der Lage, die folgenden sic reclaim wafer services anzubieten.

Warum Uns Wählen

  • kostenlose und professionelle Technologieunterstützung

    Sie können unseren kostenlosen Technologie - Service von der Anfrage bis zum Service auf unserer Basis erhalten 25+ Erfahrungen in der Halbleiterlinie.

  • guter Verkaufsservice

    unser Ziel ist es, alle Ihre Anforderungen zu erfüllen, egal wie klein Bestellungen sind und wie schwierig die Fragen sind Sie können sein, um für jeden Kunden ein nachhaltiges und profitables Wachstum durch qualifizierte Produkte und zufriedenstellenden Service zu gewährleisten.

  • 25+ Jahre Erfahrung

    mit mehr als 25 + Jahre Erfahrungen Im Bereich der Verbindungshalbleitermaterialien und Exportgeschäfte kann unser Team Ihnen versichern, dass wir Ihre Anforderungen verstehen und professionell mit Ihrem Projekt umgehen können.

  • zuverlässige Qualität

    Qualität ist unsere erste Priorität. Pam-Xiamen wurde iso9001: 2008 , besitzt und teilt vier moderne facories, die eine ziemlich große Auswahl von qualifizierten Produkten zur Verfügung stellen können, um verschiedene Bedürfnisse unserer Kunden zu erfüllen, und jede Bestellung muss durch unser stren4

"Wir haben die Powerway Epi Wafer für einige unserer Arbeiten verwendet. Wir sind sehr beeindruckt von der Qualität des Epi"
James S. Speck, Materialabteilung Universität von Kalifornien
2018-01-25
"liebe pam-xiamen-teams, danke für deinen berufsstand, das problem ist gelöst, wir sind so froh, dein partner zu sein"
Raman k. Chauhan, Seren Photonik
2018-01-25
"danke für die schnelle antwort meiner fragen und konkurrenzfähiger preis, es ist sehr nützlich für uns, wir werden bald wieder bestellen"
markus sieger, universität ulm
2018-01-25
"Die Siliziumkarbid-Wafer sind heute angekommen, und wir sind sehr zufrieden mit ihnen! Daumen hoch zu Ihrer Produktionsmannschaft!"
Dennis, Universität von Exeter
2018-01-25

Die berühmtesten Universitäten und Firmen der Welt vertrauen uns

neuesten Nachrichten

Growth of InP directly on Si by corrugated epitaxial lateral overgrowth

2019-05-23

In an attempt to achieve an InP–Si heterointerface, a new and generic method, the corrugated epitaxial lateral overgrowth (CELOG) technique in a hydride vapor phase epitaxy reactor, was studied. An InP seed layer on Si (0 0 1) was patterned into closely spaced etched mesa stripes, revealing the Si surface in between them. The surface with the mesa stripes resembles a corrugated surface. The top and sidewalls of the mesa stripes were then covered by a SiO2 mask after which the line openings on top of the mesa stripes were patterned. Growth of InP was performed on this corrugated surface. It is shown that growth of InP emerges selectively from the openings and not on the exposed silicon surface, but gradually spreads laterally to create a direct interface with the silicon, hence the name CELOG. We study the growth behavior using growth parameters. The lateral growth is bounded by high index boundary planes of {3 3 1} and {2 1 1}. The atomic arrangement of these planes, crystallographic o...

Weiterlesen

Charge transport performance of high resistivity CdZnTe crystals doped with In/Al

2019-05-13

To evaluate the charge transport properties of as-grown high resistivity CdZnTe crystals doped with In/Al, the α particle spectroscopic response was measured using an un-collimated 241Am (5.48 MeV) radioactive source at room temperature. The electron mobility lifetime products (μτ)e of the CdZnTe crystals were predicted by fitting plots of photo-peak position versus electrical field strength using the single carrier Hecht equation. A TOF technique was employed to evaluate the electron mobility for CdZnTe crystals. The mobility was obtained by fitting the electron drift velocities as a function of the electrical field strengths, where the drift velocities were achieved by analyzing the rise-time distributions of the voltage pulses formed by a preamplifier. A fabricated CdZnTe planar detector based on a low In concentration doped CdZnTe crystal with (μτ)e = 2.3 × 10−3 cm2/V and μe = 1000 cm2/(V dot m s), respectively, exhibits an excellent γ-ray spectral resolution of 6.4% (FWHM = 3.8 ke...

Weiterlesen

Selective-area growth of GaN on non- and semi-polar bulk GaN substrates

2019-05-09

We carried out the selective-area growth of GaN and fabricated InGaN/GaN MQWs on non- and semi-polar bulk GaN substrates by MOVPE. The differences in the GaN structures and the In incorporation of InGaN/GaN MQWs grown on non- and semi-polar GaN substrates were investigated. In the case of selective-area growth, different GaN structures were obtained on GaN,  GaN, and GaN substrates. A repeating pattern of  and  facets appeared on  GaN. Then, we fabricated InGaN/GaN MQWs on the facet structures on  GaN. The emission properties characterized by cathodoluminescence were different for  and  facets. On the other hand, for InGaN/GaN MQWs on non- and semi-polar GaN substrates, steps along the a-axis were observed by AFM. In particular on  GaN, undulations and undulation bunching appeared. Photoluminescence characterization indicated that In incorporation increased with the off-angle from the m-plane and also depended on the polarity. Source:IOPscience F...

Weiterlesen

Analysis of the band alignment of highly strained indium-rich GaInNAs QWs on InP substrates

2019-04-29

The focus of this paper is to present the calculations of the band alignment of indium-rich (>53%) highly strained Ga1−xInxNyAs1−y quantum wells on InP substrates which allows an emission wavelength of the order of 2.3 µm. We concentrate on the band alignment of Ga0.22In0.78N0.01As0.99 wells lattice matched to In0.52Al0.48As barriers. Our calculations show that the incorporation of nitrogen into Ga1−xInxAs improves the band alignment significantly allowing Ga0.22In0.78N0.01As0.99/In0.52Al0.48As quantum wells on InP substrates to compete with the unique band alignment of GaInNAs/GaAs quantum wells on GaAs substrates. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

Weiterlesen

High-Performance InAs Quantum Well based Corbino Magnetoresistive Sensors on Germanium Substrates

2019-04-25

High-quality InAs/Al0.2Ga0.8Sb quantum well structures were grown on Germanium substrates by molecular beam epitaxy (MBE). Electron mobilities of 27,000 cm2/Vs for sheet concentrations of nS=1.8×1012 cm-2 were routinely achieved at room temperature for undoped InAs/Al0.2Ga0.8Sb quantum well structures on Germanium substrates. We developed a simple processing technology for the fabrication of Corbino magnetoresistive devices. Excellent current sensitivities of 195 Ω/T and voltage sensitivities of 2.35 T-1 at a magnetic field of 0.15 T were measured for Corbino shaped magnetoresistors on Germanium substrate at room temperature. This sensing performance is comparable to that obtained by identical sensors on GaAs substrate. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

Weiterlesen

Structural and optical characterization of GaSb on Si (001) grown by Molecular Beam Epitaxy

2019-04-17

GaSb epilayers were grown on Si (001) using molecular beam epitaxy via AlSb quantum dots as an interfacial misfit (IMF) array between the Si substrates and GaSb epilayers. The effect of IMF array thickness, growth temperature and post annealing on the surface morphology, structural and optical properties of the GaSb on Si were investigated. Among five different IMF array thicknesses (5, 10, 20, 40 and 80 ML) that were used in this study, the best result was obtained from the sample with a 20 ML AlSb IMF array. Additionally, it was found that although the full width at half maximum (FWHM) and threading dislocation (TD) densities obtained from high resolution x-ray diffraction curves can be improved by increasing the growth temperature, a decrease in the photoluminescence (PL) signal and an increase in the surface roughness (RMS) emerged. On the other hand, the results indicate that by applying post annealing the GaSb epilayer crystal quality can be improved in terms of FWHM, TD density,...

Weiterlesen

In 2018, China's semiconductor materials market is 8.5 billion US dollars

2019-04-08

As an important part of new materials, semiconductor materials are the top priority of all countries in the world for the development of electronic information industry. It supports the development of localization of electronic information industry and is of great significance to industrial structure upgrading, national economy and national defense construction. In 2018, domestic semiconductor materials, with the joint efforts of all parties, achieved gratifying results in some areas, but the progress in the localization of key materials in the middle and high-end areas was slow, and the breakthroughs were few. The overall situation is not optimistic. China's semiconductor material segmentation progress is not uniform According to WSTS, in 2018, under the guidance of the memory market, the global semiconductor market continued to maintain rapid growth. The annual market size is expected to reach 477.94 billion US dollars, an increase of 15.9%. However, as the problem of the shortage of...

Weiterlesen

Tuning the polarity of charge transport in InSb nanowires via heat treatment

2019-04-02

InSb nanowire (NW) arrays were prepared by pulsed electrodeposition combined with a porous template technique. The resulting polycrystalline material has a stoichiometric composition (In:Sb = 1:1) and a high length-to-diameter ratio. Based on a combination of Fourier transform infrared spectroscopy (FTIR) analysis and field-effect measurements, the band gap, the charge carrier polarity, the carrier concentration, the mobility and the effective mass for the InSb NWs was investigated. In this preliminary work, a transition from p-type to n-type charge transport was observed when the InSb NWs were subjected to annealing. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com or powerwaymaterial@gmail.com

Weiterlesen

Advantages, challenges and countermeasures of GaN application in RF field

2019-03-25

At present, gallium nitride (GaN) technology is no longer limited to power applications, and its advantages are also infiltrating into all corners of the RF/microwave industry, and the impact on the RF/microwave industry is growing, and should not be underestimated, because it can be used from space, military radar to cellular communications applications. Although GaN is often highly correlated with power amplifiers (PA), it has other use cases. Since its launch, the development of GaN has been remarkable, and with the advent of the 5G era, it may be more interesting. The role of GaN in radar and space Two variants of GaN technology are GaN-on-silicon (GaN-on-Si) and GaN-on-silicon-carbide(GaN-on-SiC). According to Damian McCann, director of engineering at Microsemi's RF/Microwave Discrete Products Division, GaN-on-SiC has contributed a great deal to space and military radar applications. Today, RF engineers are looking for new applications and solutions to take advantage of GaN-on-SiC...

Weiterlesen

The generation of crystal defects in Ge-on-insulator (GOI) layers in the Ge-condensation process

2019-03-18

The formation process of crystal defects in a Ge-on-insulator layer(GOI layer)  fabricated by oxidizing a SiGe-on-insulator (SGOI) layer, known as the Ge-condensation technique, is studied systematically. It is found that the crystal defects in the GOI layer are threading dislocations and microtwins that are formed mainly in the Ge fraction range larger than ~0.5. Also, when the Ge fraction reaches ~1 and the GOI layer is formed, the density of microtwins significantly decreases and their width considerably increases. The relaxation of compressive strain, observed in SGOI and GOI layers, is not attributable to the formation of the microtwins, but to the perfect dislocations that cannot be detected as defects in the lattice image. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

Weiterlesen

kontaktiere uns

wenn Sie ein Angebot oder mehr Informationen über unsere Produkte möchten, lassen Sie uns bitte eine Nachricht, wird Ihnen so schnell wie möglich antworten.